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Product description:
Nano nickel-copper powder;
Nickel-copper nanopowder;
Nano nickel-copper alloy powder.
Product specification: 30~60nm
Item | Ni content (%) | Cu content (%) | Average particle size (nm) | Shape | Specific surface area (m?/g) | Density (g/cm?) |
Index | 30 | 70 | 45 | Spherical | 8~30 | 0.2~0.3 |
Application:
Silicone rubber conductive filler materials
Thermal conductivity filler material, anti- friction material
Catalyst, electromagnetic shield material
Substitution of silver powder in conductive application
like conductive adhesives, LCD and LED screens, touch screens, and conductive slurries used in microelectronics
Product Explanation:
Molecular formula: Ni-Cu
Appearance: Black powder
Packing, storage and shipping:
Aluminum foil packaging, 1kg, 5kg. Seal packaging.
Store in a cool &dry place. Do not contact with oxidizing agent.
