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Product Introduction:
The lead-free and silver free series solder paste is made of ultra-fine solder powder with uniform particle size and low oxygen content, as well as high-quality halogen-free flux. It is specially designed to meet the commonly used and higher process temperature alloy systems in the electronics industry, such as SnPbAg and SnAgCu, and is also suitable for other alloy systems that can replace traditional lead containing solder. After welding, Wuxi beads are produced, with good tin climbing effect and good collapse performance, suitable for various application scenarios.
Product Explanation:
Ctegory | Values/Results | Note |
Appearance | dark gray | Paste |
Metal Filler Type | SnCuNi | Adjustable |
Particle Size | Type 4：20～38 μm Type 5：15～25 μm Type 6：5～15 μm | Adjustable |
Alloy Melting Point | 240～300 ℃ | Adjustable |
Powder content | 88 ± 2% | Adjustable |
Post‑solder characteristics :
Ctegory | Values/Results | Note |
Pressure Cooker Test | Pass | 205kpa,T=121±2℃,100%RH，48HRS |
High‑Temperature Reverse Bias Test | Pass | TA=100℃,168Hrs,Bias=80%VR=36V |
Rapid temperature change | Pass | TA= -55(+0℃-10℃)/30min，TB=150℃(+15℃-0℃)℃/30min 3min 10cycles |
Current aging test | Pass | 190℃≤Tj≤200℃ IF（AV)1=30A,TA=25℃, t=168h |
Tension | Pass | 27-39 kg |
